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| 【Trade name】：Middle Speed Automatic Mounter TP50L |
【Tel】：0086-10-51669522 |
| 【Manufacturer】：Torch Technology |
【Model】：TP50L |
【Introduction】：
★High accuracy and flexibility
-0201(0.5mm X 0.25mm)
-SOIC, PLCC, BGA
-QFP (0.3mm fine-pitch )IC
★Touchless laser and vision double alignment system
★Camera system inside which learns datum mark automatically.
★Visual checking of the position where component are laid, as well as the soldering quality.
★Dispensing function , pastern or solder paste dispensing can be realized. (optional)
★Bulk components can be mounted.
★Simply programmable, easy operation.
Product summary:
TP50L is a multifunctional mounter with high accuracy and flexibility, camera system inside. All kinds of SMD components can be exactly picked and placed, including 0201、SOIC、PLCC、QFPIC（0.3mm pitch） and BGA. Easy to be operated and programmed. It is suitable for batch production. The camera system ensures the mounting precision. At the same time the laser alignment system heightens the mounting speed effectively so that the production period will be shortened and the productivity be advanced.
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【Remark】：
TP50L owns a double-alignment system. All kinds of SMD components can be exactly picked and placed by vision alignment system, such as QFPIC （0.3mm pitch） and BGA. The laser alignment system can be extended to 3 mounting heads. TP50L has the highest speed and is the best one in the TP series.
TP50L can be provided with DP-1 dispensing system in stead of a printing machine. The working procedure of making stencil will be saved. The cost will be decreased at the same time. It is especially suitable for trial-manufacture of a new product, production in small amount and multi-model production.
Added specifications:
1、TP50L series mounter stocks 8mm,12mm,16mm,24mm automatic feeders and stripe-form universal IC feeder with a special whiffing design for customers to choose from.
2、Dispensing system (optional)：
3、The disk IC replacing shelf inside, convenient for the operator to replace the whole plate of IC quickly, which heightens the working efficiency.
4、Automatic nozzle exchange system. Six kinds of nozzles can be automatically exchanged. Buffering design adjusts the mounting pressure automatically. Suitable for the montage of ceramic components and ceramic PCB plates.
5、With the help of a bulk plate, automatic mounting of bulk components can be achieved.
6、The mounting data can be programmed through keyboard, vision learning, CAD data transforming。
Specifications：
Dimension: (without feeder): Length x Width x Height 1110x1110x1400mm
Weight: 350kg (wrapper included)
Laying record: 9999
Laser head amount: TP50L1: 1 laser head , including automatic replacing device and 5 nozzles.
TP50L2: 2 laser heads, including automatic replacing device and 10 nozzles.
TP50L3: 3 laser heads, including automatic replacing device and 15 nozzles.
Resolution: X-Y axis: 0,005mm Z-axial: 0.02mm
Repeat accuracy: +/- 0.1mm (Laser alignment) + /- 0.03mm( Visual alignment)
Rotation: 0 - 360°
Min angle/step: 0.09°
Accuracy: +/- 0.09
Laying pressure : 50 to 200g
Components : 0201 - PLCC84, SOIC, BGA up to QFP256
Min pitch: 0.3mm (0.012")
Amount of the Feeders (without PCB conveyer): 116 automatic feeder can be laid from four sides. For TP50L, at most 108.
Amount of the Feeders (with PCB Conveyer): 72 automatic feeders can be laid from the front to the back .For TP50L, at most 64.
Feeder type:8, 12, 16, 24mm stripe form, IC tube form, to PLCC84, IC plate .
Pressure of element: with programmable vacuum inductor.
Lay up speed : adjustable from 1 to 5
Mounter speed: 3600? p/h ( BS390L1)
5500 p / h ( BS390L2)
7200 p /h ( BS390L3)
Laying mode: pick and place continually
Dispensing/Solder speed:7200 points /hour
Size of the point: optional time for each point.
Air pressure supply : 5,5 bar, 75psi, 0,01 Micron filter r: max150L/min
Power supply ： 100 - 240V AC / 1300W
Clearance below PCB 37mm
Diameter of the component reel: max 381mm/15"
PCB Dimension (without conveying system) feeders are laid on four sides:
Max: 560x360mm, without IC plate
Max. 560x225mm or 420x360mm, with1x IC plate
Max. 270x360mm or 420x225mm, with 2xIC plate
Max 270x225mm ,with 3xIC plate feeders laid at the front and the back：
Max. 620x360mm without IC plate
Max. 620x330mm, with IC plate
Max 620x200mm or 440x330mm with 2xIC plate
Max. 320x330mm or 620x200mm, with 3xIC plate.
Max. 330x225mm, with 4xIC plate.
PCB dimension (with transmission system)
Min. 50x50mm with feeder on front and back：
Max: 620x310mm, without IC plate
Max: 620x280mm, with 1x IC
Max. 620x190mm, with 2x IC.
Max. 620x150mm, with IC plate, and there are 16 feeders after IC：
Max: 620x230mm, with 3x IC
PCB thickness: max. 9.9mm
PCB make-up number: max. 100
Programme: keyboard input, Image learning, CAD data conversion
Control: industrial PC Pentium CPU, VGA color display, Software included.
Vision System: Camera with light 1: for Visual alignment.
Camera with light 2: for learning mode.
Component alignment:
Laser alignment, biggest component: 20x20mm.
Vision alignment : from 10x10 mm to 38x38mm (48x48mm optional)
Attachment : 10x PCB Thimble: 3x PCB
Hardware options:
DP-2 tin-pulp distributive equipment/ dropping mucilage controller
MT-2 heater inside, for controlling the temperature, timing and the pressure.
AQ48 for alignment max 48x48mm
CY-3S PCB conveying system
NZ-0201 suction nozzle for 0201 components.
UG-L1 Update device for adding one laser head.
Software options:
UC-01 is used for CAD data transforming.
SF-01 is used for offline programme. |
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