【Introduction】：

Summarize：
TX80S is used to test the quality and welding condition of BGA, CSP, Flip chip and multilayer PCB. The software system has a powerful picture processing capacity of testing and picture contrast. It is widely used to detect the inside construction of small size material ,the inside defect of metal ,medium material and mini type electron element . It is an effective way to develop new product, analyze failure, check quality and improve technics.

Characteristic of TX100S：
1、High resolution and digitized real-time testing；
2、High precision and Five- dimensional sample desk；
3、Powerful Chinese and picture processing software；
4、It has two working methods at the same time. Real-time imaging and film photograph 。

Technic points：
◆.Pentium 4 Processor；
◆.Microsoft Windows XP operating system；
◆.Synchro eliminatation of points, automatic to seek edge by black and white contract.
◆.Three-dimensional simulation；
◆.BGA welded ball testing technology,you can test any sphere and grating as long as you；
◆.Hole percentage calculation；
◆.Powerful picture collecting contrast database；
◆.Setting international language support . It is aconvenient for users；
◆.SPC and spreadsheet output capability；
◆.9 inch Monitor and reserve video output interface；