【Introduction】：

Summarize：
TX130S is used to test the quality and welding condition in BGA, CSP, Flip chip and multilayer PCB. The software-system has a powerful picture processing capacity of testing and picture contrast. It is widely used to detect the inside construction of light mareial, the inside defect of metal, medium material and Mimi type electron element. It is of great value to users in manufacture in search, analyse of failure, high veracity filter, quality detecting, technics improvement.

Characteristic of TX130S：
1、High resolution and digitized real-time testing；
2、High precision and Five- dimensional sample desk；
3、Powerful Chinese picture processing software；
4、It has two working methods at the same time. Real-time imaging and film photograph。

Technical points：
◆.Pentium 4；
◆.Microsoft Windows XP operating system；
◆.Synchronizing clearing snowflake. Searching edge automatically through contrasting black and white；
◆.Three-dimensional simulation；
◆.BGA solder bump testing technology. You can test any sphere and grating as long as you click your mouse；
◆Hole ration calculation；
◆.Powerful picture collecting contrast database；
◆.Setting international language support. It is convenient for users；
◆.SPC and spreadsheet output capability；
◆.9 inch Monitor and reserve video output interface；